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NOT RECOMMENDED FOR NEW DESIGN
Applications Information (continued)
SC618
PCB Layout Considerations
The following layout is suggested for a two-layer design.
The capacitors C1 and C2 are the bucket capacitors and
while in flash or spotlight mode. It is critical to maintain
adequate ground plane around the device to maximize
heat transfer and avoid over-temperature shutdown.
each conducts the full load current of up to 500mA pulsed
for one half clock cycle. C3 is the output decoupling
capacitor placed near the VOUT pin. C4 is the input
decoupling capacitor placed near the VIN pin. Multiple
vias should be used whenever it is necessary to change
layers on nets connecting to pins VIN, VOUT, GND, C1-,
C1+, C2- and C2+.
The load current return path is from the ISET sense point
through the resistor and back to the ground pins.
Resistance in this path adds to the total resistance and
has the effect of reducing the LED current by about 4%
per 10mV of DC drop across the return copper trace in
flash mode. For this reason, it is crucial to have a low resis-
tance return path. Place and ground the resistor as close
as possible to the ground pin of the SC618. The trace from
the ISET pin has virtually no current. The ISET trace should
make contact at the pad of the power sense resistor to
minimize the effect of voltage drop between the LED
cathode and the resistor.
Resistor R1 is routed with a very low resistance connec-
tion between R1 and GND pin 3. The sense trace between
Pin 6 and R1 is routed around the ground vias, allowing
the shortest ground return path possible. The sense trace
is connected to R1 at the positive terminal pad for the
most accurate output possible. The bottom copper layer
is mostly a ground plane with no obstructions between
the ground vias. The smaller rectangle to the left con-
nects the input power to VIN pin 1 and input capacitor
C4. The two traces at the lower left are for logic inputs
FLASH and CTRL. The trace to the right is the ISET pin
sense trace. The sense trace is routed out of the path of
the returning ground current.
Thermal Resistance Considerations
The SC618 package is thermally effi cient when the circuit
board layout connects the thermal pad through multiple
vias to the ground plane. The thermal resistance is rated
at 40°C/W, and this rating is dependent on the connec-
tion between the thermal pad and the ground plane. The
layout should keep the junction temperature below the
OTP limit while operating the SC618 within the specified
electrical conditions for I OUT and V ISET . A poor layout may
allow the junction temperature to reach the OTP limit
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